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Customer Requirements for Consigned and Turnkey Kits


In order for HI-Q.A. to properly evaluate an assembly for a quotation, the following items are required:


2.1 Pick List

A pick list identifying the following must be sent with the kit:

2.2 Component Identification

All components must be suitably identified with the following:

Please ensure that all parts inside ESD bags are also labeled on the reel or strip as well as the bag.

2.3 Component Packaging

SMT Components:

  • Must have a 10" leader, the number of required components plus 10% attrition on all SMT items and small packaged types of components.
  • All SMT components must be received on tape and reel (in continuous tape) and/or must be in original or replica packages. For example, connectors and fine pitch ICS should arrive in matrix trays of correct part size and type.
  • SMT components received in bulk or on spliced reels may be subject to an additional material handling quote.

Other Components:

  • Axial leaded through-hole components must have 5% attrition and be suitably identified on a reel if sequence is required.
  • Must have some attrition on low cost items such as hardware and bulk manual parts.

All components must be assigned to a particular work order so that common components are not shared between jobs.


NOTE: A kit will be rejected at verification if any of the criteria specified above is not met.



In order for HI-Q.A. to manufacture an assembly, the following items are required:

5.1 Bill of Materials (BOM)

A soft copy of the BOM is preferred in MS Excel or PDF format. The BOM shall be a revision-controlled copy that includes the following data:

Sample BoM

HI-Q.A. Keypad Assembly - H1002345 rev 2
Description Manufacturer Manufacturer's
Part Number
Qty. per
Ref. Des. Tech.
1 H1005376 OP AMP QUAD 4MHZ Kemet OP482GPZ 3 C1, C2, C3 SMT
2 H1009847 Header, 2x6 2mm Milex 87089-1216 1 J8 T/H

5.2 Gerber File

Gerber files provide information about the surface mount pads, solder mask and silk-screen. The gerber files allows for the procurement of a solder paste stencil.

All assembly layers shall be provided to HI-Q.A. by the customer. The paste layers should include the global fiducials as well as the board outline. The outer copper layers are used to determine the proper aperture reductions for the solder paste layers. If the raw cards are to be in a panelized format, the Gerber file shall be in the same format. HI-Q.A. can accept most gerber formats.

5.3 Assembly Drawing File

For soft copies of assembly drawings, the preferred format is PDF. The silk-screen layers from the Gerber file can be used if all of the designations are included. Any special assembly instructions that are not evident from the other information supplied must be clearly noted. For example, this could include parts that have to be soldered off of the board surface and parts that have polarities that do not follow normal convention.

5.4 Pick and Place File

If there are surface mount components associated with the assembly, a placement file (pick and place file) is required. This file must contain the following:

HI-Q.A. prefers to have pick and place files in metric (mm) units and numeric fields separated from text fields in either Notepad or Excel formats.

5.5 Test Requirements

If HI-Q.A. is requested to perform any assembly test verification, then all expectations must be presented at the quotation phase (test specifications, test strategies/plans, electrical schematic, etc.). The customer must provide training, test requirements, expected results and equipment, as required.

For any questions about this document or its contents, please contact:

(p) 613-257-2802
(e) sales@hiqa.com